EN
FST 6000 Online Thin Film Stress Tester
Measurement of bow height, warpage, profile morphology, ROC and film stress for wafer-like photonic film samples
1High-throughput Process Control Solution
2 Dual-wavelength Scanning
3 Fully Automated Measurement
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Appointment for trial
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Product Introduction
Based on the principles of the classical substrate curvature method (Stoney formula), and utilizing advanced laser scanning and detection techniques, along with intelligent operation, the FST5000 thin film stress tester is particularly well-suited for measuring and calculating bow height, warpage, profile morphology, radius of curvature, and film stress of wafer-like photonic film samples.